Logical Devices Chip Master 6000 Intelligent Universal Programmer

Used

Plasma ashing is the process of removing photoresist from an etched wafer. Ashing is performed with fluorine or oxygen and is almost always used with a single gas plasma. The versatile PE-75 comes with two gases installed for other cleaning and ashing purposes.

Electrode Configuration: One Horizontal (9"Wx10"D + 5.5" Clearance)

Generator: 400W 50KHz Continuously Variable Power Supply

Gas Control: Two 0-25cc/min Rotometers with Precision Needle Valves

Control System: PLC-Based Keypad Input System with Alphanumeric Display; Stores One Recipe for Automatic Process Sequencing

Chamber Material: 6061-T6 Aluminum

Chamber Dimensions: 10.75” Deep x 10” Round

Unit Dimensions: 18"x19"x24"

Unit Weight: 90lbs

Vacuum System Not Included:

Vacuum Gauge: 1-2000 mT

Vacuum Pump: 5CFM 2-Stage Direct Drive Oil Pump (Oxygen Service – Krytox Charged)